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MTD2955V
Power MOSFET 12 A, 60 V
P ? Channel DPAK
This Power MOSFET is designed to withstand high energy in the
avalanche and commutation modes. Designed for low voltage, high
speed switching applications in power supplies, converters and power
motor controls, these devices are particularly well suited for bridge
circuits where diode speed and commutating safe operating areas are
critical and offer additional safety margin against unexpected voltage
transients.
Features
? Avalanche Energy Specified
? I DSS and V DS(on) Specified at Elevated Temperature
? Pb ? Free Packages are Available
MAXIMUM RATINGS (T C = 25 ° C unless otherwise noted)
http://onsemi.com
12 A, 60 V
R DS(on) = 185 m W (Typ)
P ? Channel
D
Rating
Symbol
Value
Unit
Drain ? to ? Source Voltage
Drain ? to ? Gate Voltage (R GS = 1.0 M W )
V DSS
V DGR
60
60
Vdc
Vdc
G
Gate ? to ? Source Voltage
S
? Continuous
? Non ? repetitive (t p ≤ 10 ms)
V GS
V GSM
± 20
± 25
Vdc
Vpk
Drain Current ? Continuous
Drain Current ? Continuous @ 100 ° C
Drain Current ? Single Pulse (t p ≤ 10 m s)
Total Power Dissipation
Derate above 25 ° C
Total Power Dissipation @ 25 ° C (Note 2)
I D
I D
I DM
P D
12
8.0
42
60
0.4
2.1
Adc
Apk
Watts
W/ ° C
Watts
1 2
3
4
DPAK ? 3
CASE 369C
STYLE 2
Operating and Storage Temperature
Range
T J , T stg
? 55 to
175
° C
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 25 Vdc, V GS = 10 Vdc, Peak
I L = 12 Apk, L = 3.0 mH, R G = 25 W )
E AS
216
mJ
4
DPAK ? 3
Thermal Resistance
? Junction to Case
? Junction to Ambient (Note 1)
? Junction to Ambient (Note 2)
R q JC
R q JA
R q JA
2.5
100
71.4
° C/W
1
2
3
CASE 369D
STYLE 2
Maximum Lead Temperature for Soldering
Purposes, 1/8 ″ from case for 10
seconds
T L
260
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using the minimum recommended
pad size.
2. When surface mounted to an FR4 board using the 0.5 sq.in. pad size.
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 7 of this data sheet.
? Semiconductor Components Industries, LLC, 2006
August, 2006 ? Rev. 8
1
Publication Order Number:
MTD2955V/D
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